- Double-Sided PCB[10]
- FPC[10]
- Multilayer PCB[10]
- Rigid PCB[10]
- Single-Sided PCB[5]
Immersion tin CEM-1 PCB
1.PCB Prototypes,Fabrication and Production
2.Over10 years in PCB field
3.Top quality with best price
4.ISO,UL,RoHs,SGS etc
We can produce single-sided printed board(ssb), double-sided printed board(dsb), multilayer PCBs, HDI PCBs, FPC and PCBA according to your provided data files or your samples.
HECPCB CAPABILITY-High Volume Conventional PCB
Surface | Gold plating\HAL\OSP\Gold finger |
Raw Material | FR4, FR5(High TG), CEM-1, AI-base… |
Max. Board Size | 600mm*800mm |
Min. Board Size | 5mm*5mm |
Warp age | Single-side<1.0%,Double-side<0.6%,Multilayer<0.6% |
Min. Thickness & Tolerance | 0.2mm+0.08mm |
Min. Line Width / Space & Tolerance | HAL PCB: 0.10mm+20% (4mil+20%); Gold PCB: 0.075mm+20% (3mil+20%) |
Copper to Edge-board Spacing | 0.5mm (20mil) |
Hole side to Edge-board Spacing | 0.3mm (7.87mil) |
Min. Hole Size & Tolerance | Size: 0.1mm/4mil(laser hole) Tolerance: +0.075mm/3mil for PTH Diameter; +0.05mm/2mil for Non-PTH Diameter |
Min. Hole Space & Tolerance | 0.4mm+0.076mm (15.75mil+3mil) |
Hole Wall Thickness | 20-25um (0.79mil-1.0mil) |
Hole Position Deviation | +0.076mm (+3mil) |
Min. Round Hole Dia.(for Punch) | 1.0mm(40mil) with PCB thickness <FR-4 1.0mm; 1.5mm(59mil) with PCB thickness FR4 1.2-3.0mm (47mil-120mil) |
Min. Square Figure hole Dia.(for Punch) | 0.8MM x 0.8mm(31.5mil x 31.5mil) with PCB thickness < FR-4 & CEM-3 1.0mm; 1.0mm x 1.0mm(40mil x 40mil) with PCB thickness FR-4 & CEM-3 1.2-3.00mm(47mil-120mil) |
Finished Board Size Tolerance | CNC: +0.1mm(+4mil); Punch: +0.15mm(+6mil) |
V-cut Position Tolerance | +0.2mm(+8mil) |
Base Material Thickness | 0.2-3.5mm |
Base Material Copper Thickness | 18um, 35um, 70um |
Electrolytic Flash Gold with thickness of 0.4 to 3.0 micro inches | Au: 0.01 to 0.076 micron; Ni: 5~15mm |
Selective Immersion Gold with thickness of 1 to 4 micro inches | Au: 0.025 to 0.1 micron; Ni: 2.54~5.5mm |
Gold tab/finger plating with thickness of 5 to 30 micro inches | Au: 0.125 to 0.76 micron; Ni: 1.27~12mm |
Electroless Immersion Tin with thickness of 20 to 48 micro inches | 05 to 1.2 micron |
Organic solder ability Preservatives | Entek Cu 106A HT, Prefulx F2 LX |
HECPCB Factory overview- Equipment list
Cut Copper Foil Machine | Auto.Flash Gold Plating Line(Cu/Ni/Au)and line for (Cu/Sn) |
Cut Prepreg Machine | Scrubbing Machine (I. S) |
Scrubbing Machine | Auto. Printing Machine |
Auto Cut Sheet Laminator | Conveyor Oven |
Exposer | Electroless Nickel/Gold Plating Line |
Developer,Etching & Stripping Machine | Immersion Tin Auto. Line |
Black Oxide Line & Oven | Gold –Finger Plating Line |
Auto. Vacuum Laminator | Horizontal HAL Machine |
X-ray Trarget Hole Drilling Machine | Punching Machine |
CNC Drilling Machine / Laser drilling machine (Japan) | CNC Routing Machine |
Programmer | Bevelling Machine |
Registration Drill | CNC V-cut Machine |
Drill Sharpener | E-Tester |
Auto.Desmear & PTH Line | Fly Probe Tester |
Auto. Panel Plating Line | Organic Coating Line |
Scrubbing Machine(IS) | Auto.Film Processor |
Developer | CAM Station(Orbotech Genesis 2000) |
We sincerely hope to establish long term and friendly business relationship with your esteemed company. Good quality, reasonable price and the 5-Star service are guaranteed. Please kindly let us know your requirements.We will give you the best price soon.