HECPCB Electronic Co., Ltd.

Single-sided PCB with Immersion Gold-plated Finish and Wide Applications

Single-sided PCB with Immersion Gold-plated Finish and Wide Applications
Product Detailed

1.We have over 10 years experience in PCB filed
2.Fast delivery and classic service
3.Our PCB board get ISO,UL,RoHs, SGS ect

Single-sided PCB FR4 (KB): 1.0mm 1oz Immersion gold-plated, V-cut, red LPI Minimum line space width: 0.2mm Gold-thickness: 3U" Specializing in high-tech PCBs for about 10 years Large production capability with hi-class production equipment Professional engineering assistance, including design rule check of customer data In-house PCB R&D center Quick turnaround For these electric applications: LCD monitors and LCD TV Sets Military systems Notebook computers' main board and networking equipment Multimedia devices (such as MP3/MP4 players, PDAs) Home appliances Telecom products such as Mobile phones Audio and video products

We can produce single-sided printed board(ssb), double-sided printed board(dsb), multilayer PCBs, HDI PCBs, FPC and PCBA according to your provided data files or your samples.

HECPCB CAPABILITY-High Volume Conventional PCB

Surface

Gold plating\HAL\OSP\Gold finger

Raw Material

FR4, FR5(High TG), CEM-1, AI-base…

Max. Board Size

600mm*800mm

Min. Board Size

5mm*5mm

Warp age

Single-side<1.0%,Double-side<0.6%,Multilayer<0.6%

Min. Thickness & Tolerance

0.2mm+0.08mm

Min. Line Width / Space & Tolerance

HAL PCB: 0.10mm+20% (4mil+20%); Gold PCB: 0.075mm+20% (3mil+20%)

Copper to Edge-board Spacing

0.5mm (20mil)

Hole side to Edge-board Spacing

0.3mm (7.87mil)

Min. Hole Size & Tolerance

Size: 0.1mm/4mil(laser hole)

Tolerance: +0.075mm/3mil for PTH Diameter;  +0.05mm/2mil for Non-PTH Diameter

Min. Hole Space & Tolerance

0.4mm+0.076mm (15.75mil+3mil)

Hole Wall Thickness

20-25um (0.79mil-1.0mil)

Hole Position Deviation

+0.076mm (+3mil)

Min. Round Hole Dia.(for Punch)

1.0mm(40mil) with PCB thickness <FR-4 1.0mm;

1.5mm(59mil) with PCB thickness FR4 1.2-3.0mm (47mil-120mil)

Min. Square Figure hole Dia.(for Punch)

0.8MM x 0.8mm(31.5mil x 31.5mil) with PCB thickness < FR-4 & CEM-3 1.0mm;

1.0mm x 1.0mm(40mil x 40mil) with PCB thickness FR-4 & CEM-3 1.2-3.00mm(47mil-120mil)

Finished Board Size Tolerance

CNC: +0.1mm(+4mil); Punch: +0.15mm(+6mil)

V-cut Position Tolerance

+0.2mm(+8mil)

Base Material Thickness

0.2-3.5mm

Base Material Copper Thickness

18um, 35um, 70um

Electrolytic Flash Gold with thickness of 0.4 to 3.0 micro inches

Au: 0.01 to 0.076 micron; Ni: 5~15mm

Selective Immersion Gold with thickness of 1 to 4 micro inches

Au: 0.025 to 0.1 micron; Ni: 2.54~5.5mm

Gold tab/finger plating with thickness of 5 to 30 micro inches

Au: 0.125 to 0.76 micron; Ni: 1.27~12mm

Electroless Immersion Tin with thickness of 20 to 48 micro inches

05 to 1.2 micron

Organic solder ability Preservatives

Entek Cu 106A HT, Prefulx F2 LX

 

 



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