- Double-Sided PCB[10]
- FPC[10]
- Multilayer PCB[10]
- Rigid PCB[10]
- Single-Sided PCB[5]
Single-sided Gold Plating PCB with Black Sold Mask and 1.6mm Board Thickness Wide Applications
1.We have over 10 years experience in PCB field
2.Fast delivery and Quick turnaround
3.Our PCB board get ISO,UL,RoHs, SGS ect
Single-sided PCB FR4 (KB): 1.6mm 1oz Immersion gold-plated, V-cut, red LPI Minimum line space width: 0.15mm Gold-thickness: 4U" Specializing in high-tech PCBs for about 10 years Large production capability with hi-class production equipment Professional engineering assistance, including design rule check of customer data In-house PCB R&D center Quick turnaround For these electric applications: LCD monitors and LCD TV Sets Military systems Notebook computers' main board and networking equipment Multimedia devices (such as MP3/MP4 players, PDAs) Home appliances Telecom products such as Mobile phones Audio and video products
We can produce single-sided printed board(ssb), double-sided printed board(dsb), multilayer PCBs, HDI PCBs, FPC and PCBA according to your provided data files or your samples.
HECPCB CAPABILITY-High Volume Conventional PCB
Surface | Gold plating\HAL\OSP\Gold finger |
Raw Material | FR4, FR5(High TG), CEM-1, AI-base… |
Max. Board Size | 600mm*800mm |
Min. Board Size | 5mm*5mm |
Warp age | Single-side<1.0%,Double-side<0.6%,Multilayer<0.6% |
Min. Thickness & Tolerance | 0.2mm+0.08mm |
Min. Line Width / Space & Tolerance | HAL PCB: 0.10mm+20% (4mil+20%); Gold PCB: 0.075mm+20% (3mil+20%) |
Copper to Edge-board Spacing | 0.5mm (20mil) |
Hole side to Edge-board Spacing | 0.3mm (7.87mil) |
Min. Hole Size & Tolerance | Size: 0.1mm/4mil(laser hole) Tolerance: +0.075mm/3mil for PTH Diameter; +0.05mm/2mil for Non-PTH Diameter |
Min. Hole Space & Tolerance | 0.4mm+0.076mm (15.75mil+3mil) |
Hole Wall Thickness | 20-25um (0.79mil-1.0mil) |
Hole Position Deviation | +0.076mm (+3mil) |
Min. Round Hole Dia.(for Punch) | 1.0mm(40mil) with PCB thickness <FR-4 1.0mm; 1.5mm(59mil) with PCB thickness FR4 1.2-3.0mm (47mil-120mil) |
Min. Square Figure hole Dia.(for Punch) | 0.8MM x 0.8mm(31.5mil x 31.5mil) with PCB thickness < FR-4 & CEM-3 1.0mm; 1.0mm x 1.0mm(40mil x 40mil) with PCB thickness FR-4 & CEM-3 1.2-3.00mm(47mil-120mil) |
Finished Board Size Tolerance | CNC: +0.1mm(+4mil); Punch: +0.15mm(+6mil) |
V-cut Position Tolerance | +0.2mm(+8mil) |
Base Material Thickness | 0.2-3.5mm |
Base Material Copper Thickness | 18um, 35um, 70um |
Electrolytic Flash Gold with thickness of 0.4 to 3.0 micro inches | Au: 0.01 to 0.076 micron; Ni: 5~15mm |
Selective Immersion Gold with thickness of 1 to 4 micro inches | Au: 0.025 to 0.1 micron; Ni: 2.54~5.5mm |
Gold tab/finger plating with thickness of 5 to 30 micro inches | Au: 0.125 to 0.76 micron; Ni: 1.27~12mm |
Electroless Immersion Tin with thickness of 20 to 48 micro inches | 05 to 1.2 micron |
Organic solder ability Preservatives | Entek Cu 106A HT, Prefulx F2 LX |
Item | Sample Delivery Lead Time | Normal Delivery Lead Time | ||
PCB | Normal | Special | Repeat | New |
Single & Double | 4days | 2days | 7-14days | 8-15days |
4 layers | 6days | 3days | 8-15days | 9-15days |
6 layers | 8days | 4days | 10-16days | 12-18days |
8 layers | 10days | 6days | 15-25days | 15-25days |
10 layers | 14days | 8days | 16-26days | 16-26days |
12 layers | 16days | 10days | 20-28days | 22-30days |