HECPCB Electronic Co., Ltd.

FR4 immersion gold PCB

FR4 immersion gold PCB
Product Detailed

(1)Immersion Gold
(2)UL:E313409, ISO9001:2000,Rohs
(3)FR-4
(4)Routing:CNC

PCB production process

  

 

 

 Technical Capability

    

Min Lin Width/Space

3mil(0.076mm)/3mil(0.076mm)

Min Hole Size

3mil

Max Finished Thickness

8mm

Aspect Ratio

≤12:1

Max Layers

36 Layers

Surface Finish

Immersion Gold, Immersion Silver, Immersion Tin, HASL, LF-HASL, OSP, Gold Finger, etc

Base Material Types

FR-4, Metal Base(Aluminum base,Copper Base, etc),PTFE(Rogers,ARLON,TACONIC,etc),      Ceramics Base Laminates

Special Technology

Resin Plugged(POFV), Blind&buried Hole Boards, Fixed Surface Finish



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